Kickoff for a new generation of even more intelligent Systems Th e F r a unhof e r I n s ti tu te fo r M i cro e l e c tro n i c C i rc ui ts and Sy s tems wi ns the 1 2 i nv es ts 16 M i l l i on - Electrical bonding - Document - PDFSEARCH.IO

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	Kickoff for a new generation of even more intelligent Systems Th e F r a unhof e r I n s ti tu te fo r M i cro e l e c tro n i c C i rc ui ts and Sy s tems wi ns the 1 2 i nv es ts 16 M i l l i on Add to Reading List Document Date: 2014-02-15 05:06:15 Open Document File Size: 517,33 KB Share Result on Facebook Company Hella KGaA / MicroElectro-Mechanical Systems / Carl Zeiss Optronics GmbH / EPCOS AG / DIAS Infrared GmbH / Vitron GmbH / BMW AG / / IndustryTerm industri al applications / consumer electronics / photon detection systems / process control tools / galvanic and flip chip / / Organization Federal Ministry of Research / / Region North Rhine / / Technology process control / galvanic and flip chip / MEMS / / SocialTag Electromagnetism Semiconductor device fabrication Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Etching Wafer bonding Infrared Materials science

Kickoff for a new generation of even more intelligent Systems Th e F r a unhof e r I n s ti tu te fo r M i cro e l e c tro n i c C i rc ui ts and Sy s tems wi ns the 1 2 i nv es ts 16 M i l l i onAdd to Reading List