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Wafer bonding
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1	Wafer-level Processes INSPECTION Checking for waferto-wafer bonding integrity Detection of internal Add to Reading List Source URL: www.sonoscan.com - Date: 2016-07-20 11:09:32
2	Wafer-level Processes INSPECTION Checking for waferto-wafer bonding integrity Detection of internal Add to Reading List Source URL: www.sonoscan.com - Date: 2016-07-20 11:09:32
3	1 銅錫晶圓接合 CU/SN WAFER BONDING 范承翰 Add to Reading List Source URL: diamondprj.nctu.edu.tw Language: Korean - Date: 2013-09-25 03:33:17
4	Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication Add to Reading List Source URL: www.sonoscan.com Language: English - Date: 2016-07-20 11:09:32 Electronics manufacturing Packaging Microtechnology Semiconductor device fabrication Wafer bonding SUSS MicroTec Wafer Microelectromechanical systems Acoustic microscopy Silicon on insulator Eutectic bonding Capacitive micromachined ultrasonic transducers
5	EV Group Joins IRT Nanoelec 3D Integration Program ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresis Add to Reading List Source URL: www.irtnanoelec.fr Language: English - Date: 2016-02-16 05:36:25
6	74 Technology focus: Photovoltaics Room-temperature wafer bonding for multi-junction III-V solar cells Add to Reading List Source URL: www.semiconductor-today.com Language: English - Date: 2015-08-01 07:54:50
7	58 Technology focus: III-Vs-on-silicon Transparent conductive oxides and wafer bonding of III-Vs and silicon A low-temperature process at 200ºC results in electrical resistance of Add to Reading List Source URL: www.semiconductor-today.com Language: English - Date: 2015-10-01 12:02:32
8	Kickoff for a new generation of even more intelligent Systems Th e F r a unhof e r I n s ti tu te fo r M i cro e l e c tro n i c C i rc ui ts and Sy s tems wi ns the 1 2 i nv es ts 16 M i l l i on Add to Reading List Source URL: www.ims.fraunhofer.de Language: English - Date: 2014-02-15 05:06:15 Electromagnetism Semiconductor device fabrication Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Etching Wafer bonding Infrared Materials science Technology Microtechnology
9	@ IEEE ECTC 2015 in San Diego, CA Tuesday, May 26, 2015 Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-06-08 14:48:42 Physics Electronics manufacturing Chemical bonding Wafer bonding
10	FHG_pantone_nicht_ueberdr Add to Reading List Source URL: www.ibp.fraunhofer.de Language: English - Date: 2015-06-08 06:21:24 Materials science Clean Sky Selective laser melting Science Wafer bonding Fraunhofer Additive Manufacturing Alliance Fraunhofer Group for Microelectronics Fraunhofer Society Laboratories Technology