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Physics / Electronics manufacturing / Chemical bonding / Wafer bonding


@ IEEE ECTC 2015 in San Diego, CA Tuesday, May 26, 2015
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Document Date: 2015-06-08 14:48:42


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File Size: 173,97 KB

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City

San Diego / /

Company

Contag AG / STMicroelectronics / Micro Crystal AG / /

Facility

Technical University of Berlin / Technical University / Pavilion Dependency / Harbor Island / VTT Technical Research Centre / /

NaturalFeature

Harbor Island / /

Organization

Technical University Berlin / VTT Technical Research Centre of Finland / Optical Interconnects Thin Glass Based Electro-Optical Circuit Board / Technical University of Berlin / /

Person

Marcel Neitz / Lars Brusberg / Dominik Pernthaler / Volker Bader / Rolf Aschenbrenner / Steve Voges / Stefan Schmitz / Sebastian Marx / Karin Hauck / Stefan Raatz / Michael Töpper / Ivan Ndip / Ruben Kahle / Tanja Braun / Karl-Friedrich Becker / Matthias Hutter / Marco Queisser / Danny Jaeger / Mario Schima / Active Power Cycling Constanze Weber / Coupling Interfaces Lars Brusberg / Christian Herbst / Klaus-Dieter Lang / Tina Thomas / Christian Ranzinger / Jens Hofmann / Henning Schröder / /

Technology

Sub-4 μm Via Technology / Laser / MEMS / Technology of Thinfilm Polymers Using Scanning Laser Ablation Michael Töpper / /

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