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Physics / Passive fire protection / Heat conduction / Electronic design / Thermal management of electronic devices and systems / Heat transfer / Microelectromechanical systems / Data center / Thermal copper pillar bump / Mechanical engineering / Concurrent computing / Engineering


Microsoft Word - ST31_Call_For_Papers_v1
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Document Date: 2014-04-14 14:40:20

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File Size: 107,45 KB

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City

San Jose / /

Company

Intel Corporation / Renewable Energy / /

Country

United States / /

/

Facility

DoubleTree Hotel / /

IndustryTerm

characterization equipment / electronics / nano-scale devices / electronics thermal management / thermal management / simulation software / mover technologies / /

Organization

SEMI / /

Person

SEMI-THERM / /

Position

Program Chair / Principal Engineer / /

Technology

Fluid Dynamics / Air mover technologies / Heat Transfer / MEMS / simulation / 3-D / PDF / /

URL

www.semi-therm.org / http /

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