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Thermal copper pillar bump
Results: 4

#	Item
1	Microsoft Word - ST31_Call_For_Papers_v1 Add to Reading List Source URL: www.semi-therm.org Language: English - Date: 2014-04-14 14:40:20 Physics Passive fire protection Heat conduction Electronic design Thermal management of electronic devices and systems Heat transfer Microelectromechanical systems Data center Thermal copper pillar bump Mechanical engineering Concurrent computing Engineering
2	HIGH CURRENT PROPERTIES OF A MICROSPRING CONTACT FOR FLIP CHIP PACKAGING Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2010-04-28 10:14:48 Solder Flip chip Semiconductor device fabrication Solid Switch Electromigration Thermal copper pillar bump Electronic engineering Electronics Condensed matter physics
3	NISTIR[removed]Performance of Thermal Exposure Sensors in Personal Alert Safety System (PASS) Devices Nelson Bryner Add to Reading List Source URL: www.fire.nist.gov Language: English - Date: 2006-04-26 11:07:26 Sensors Measurement Transducers Firefighter Infrared imaging Thermal copper pillar bump Microbolometer Safety Technology Measuring instruments
4	Simulation Cuts IC Cost 20% by Comparing Flip Chip/Wirebond Thermal Performance Add to Reading List Source URL: s3.mentor.com Language: English - Date: 2013-06-21 14:24:23 Electronics Mechanical engineering Electronic design automation Heat sink Simulation software Thermal management of electronic devices and systems Flip chip Integrated circuit Thermal copper pillar bump Electronic engineering Passive fire protection Heat transfer

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