Date: 2015-08-26 02:29:40Semiconductor device fabrication Semiconductor devices Integrated circuits Monolithic microwave integrated circuit Packaging Reliability Integrated circuit packaging Integrated circuit Flip chip Gallium arsenide Transistor | | 「維基夥伴獎學金」獎助生成果報告書 簡報檔 Backside Via Hole and Flip-Chip Packaging of GaAs MMICs for W-Band Applications Adviser:Prof. Edward Yi ChangAdd to Reading ListSource URL: diamondprj.nctu.edu.twDownload Document from Source Website File Size: 134,90 KBShare Document on Facebook
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