Date: 2016-07-20 11:09:32Electronics manufacturing Packaging Microtechnology Semiconductor device fabrication Wafer bonding SUSS MicroTec Wafer Microelectromechanical systems Acoustic microscopy Silicon on insulator Eutectic bonding Capacitive micromachined ultrasonic transducers | | Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabricationAdd to Reading ListSource URL: www.sonoscan.comDownload Document from Source Website File Size: 1,47 MBShare Document on Facebook
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