![Technology / Embedded Wafer Level Ball Grid Array / Three-dimensional integrated circuit / Qimonda / Integrated circuit packaging / Wafer-level packaging / Semiconductor device fabrication / Electronics / Microtechnology Technology / Embedded Wafer Level Ball Grid Array / Three-dimensional integrated circuit / Qimonda / Integrated circuit packaging / Wafer-level packaging / Semiconductor device fabrication / Electronics / Microtechnology](https://www.pdfsearch.io/img/2bd0ae48ec5ca5c287fc08201591df10.jpg) Date: 2014-03-10 05:00:00Technology Embedded Wafer Level Ball Grid Array Three-dimensional integrated circuit Qimonda Integrated circuit packaging Wafer-level packaging Semiconductor device fabrication Electronics Microtechnology | | Brokerage H2020 Call ICT2 – 2014 Partner Presentation: NANIUM S.A[removed]Partner and contact person: NANIUM S.A., Vila do Conde, Porto, Portugal Steffen Kröhnert, Director of Technology Expertise and Activities:Add to Reading ListSource URL: ec.europa.euDownload Document from Source Website File Size: 847,88 KBShare Document on Facebook
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