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Technology / Embedded Wafer Level Ball Grid Array / Three-dimensional integrated circuit / Qimonda / Integrated circuit packaging / Wafer-level packaging / Semiconductor device fabrication / Electronics / Microtechnology
Date: 2014-03-10 05:00:00
Technology
Embedded Wafer Level Ball Grid Array
Three-dimensional integrated circuit
Qimonda
Integrated circuit packaging
Wafer-level packaging
Semiconductor device fabrication
Electronics
Microtechnology

Brokerage H2020 Call ICT2 – 2014 Partner Presentation: NANIUM S.A[removed]Partner and contact person: NANIUM S.A., Vila do Conde, Porto, Portugal Steffen Kröhnert, Director of Technology Expertise and Activities:

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