![Technology / Embedded Wafer Level Ball Grid Array / Three-dimensional integrated circuit / Qimonda / Integrated circuit packaging / Wafer-level packaging / Semiconductor device fabrication / Electronics / Microtechnology Technology / Embedded Wafer Level Ball Grid Array / Three-dimensional integrated circuit / Qimonda / Integrated circuit packaging / Wafer-level packaging / Semiconductor device fabrication / Electronics / Microtechnology](https://www.pdfsearch.io/img/2bd0ae48ec5ca5c287fc08201591df10.jpg)
| Document Date: 2014-03-10 05:00:00 Open Document File Size: 847,88 KBShare Result on Facebook
City Porto / / Company NANIUM S.A. / Assembly and Test Manufacturing / FA - Focus / House LABS / Infineon Technologies / Siemens Semiconductors / Leading Edge Embedding Technologies / / Continent Europe / / Country Portugal / / Facility Largest Independent Packaging Foundry / Facility Located / Packaging Foundry / / IndustryTerm manufacturing capability / / Organization SEMI / General Services Administration / APC Committee / IMAP / Years Assembly / / Person Steffen Kröhnert / / / Position Director of Technology Expertise and Activities / / ProvinceOrState South Carolina / /
SocialTag |