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Semiconductor device fabrication / Electronics manufacturing / Wafer bonding / Wafer / Direct bonding / Silicon on insulator / Thermal oxidation / Etching / Eutectic bonding / Microtechnology / Electronics / Materials science


SEMI-FINISHED BONDED SUBSTRATES: SOI-WAFER (SILICON ON INSULATOR) 1
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Document Date: 2015-01-15 09:59:22

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Facility

Fraunhofer Institute / /

Organization

SEMI / Fraunhofer Institute for Electronic Fraunhofer ENAS / /

Person

SEMI-FINISHED BONDED SUBSTRATES / Maik Wiemer / Dirk Wuensch / /

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