![Technology / Wafer-level packaging / Microelectromechanical systems / Wafer / Three-dimensional integrated circuit / Chip scale package / Integrated circuit / Flip chip / Etching / Semiconductor device fabrication / Electronics / Microtechnology Technology / Wafer-level packaging / Microelectromechanical systems / Wafer / Three-dimensional integrated circuit / Chip scale package / Integrated circuit / Flip chip / Etching / Semiconductor device fabrication / Electronics / Microtechnology](https://www.pdfsearch.io/img/f13d0da1d56492bf094608d06a3f3f08.jpg) Date: 2015-05-06 03:08:02Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology | | F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level PackagingAdd to Reading ListSource URL: www.izm.fraunhofer.deDownload Document from Source Website File Size: 735,13 KBShare Document on Facebook
|