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Semiconductor device fabrication / Electronics manufacturing / Multi-chip module / Integrated circuit / Printed circuit board / Flip chip / Wire bonding / Capacitor / Quad Flat Package / Electronics / Electronic engineering / Electromagnetism


• l . SILICON MULTICHIP MODULES
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Document Date: 2013-07-27 22:44:07

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File Size: 329,43 KB

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Company

Peters & David Tuckerman nCHIP Inc. / SINGLE CHIP PACKAGING SOLUTIONS / /

Currency

pence / cent / USD / /

IndustryTerm

process technology / interconnect technology / /

Organization

nCHIP SILICON CIRCUIT BOARD / /

Person

Donald Benson / Van Nostrand / Bruce McWilliams / /

Technology

process technology / Assembly Wire bond Flip chip / IC chip / Dielectric / integrated circuit / /

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