Back to Results
First PageMeta Content
Electromagnetism / Ball grid array / Flip chip / Surface-mount technology / Flexible circuit / Printed circuit board / Solder / Chip scale package / Integrated circuit / Electronics manufacturing / Electronics / Electronic engineering


Document Date: 2009-09-24 19:28:26

Open Document

File Size: 636,64 KB

Share Result on Facebook

City

Flex / San Diego / San Jose / /

Company

IBM / General Electric / Tessera / Sony / AMKOR / Dupont / Flex-Based Packaging Solutions / Texas Instruments / HP / Intel / /

/

IndustryTerm

basic systems / metal posts / connection site / unusual processing / tiny flip chip / little metal / important technology / wafer-level systems / alternate method uses etching solution / metal heat spreader / heat management / ink jet chip / direct chip / energy / low cost processing / metal / removable carrier / fiberoptic Internet backbone / ultra-high density semi-additive processing / circuit solution / thin metal layer / chip carrier / carrier/foil2 / metal spheres / metal balls / metal plates / /

Movie

Soon / /

Organization

ALIVH High-Density Printed Wiring Board / /

Person

Ken Gilleo / Francis Hugle / Van Nostrand Reinhold / /

Position

conductor / /

Product

Digital Micro DeviceTM / /

ProgrammingLanguage

DC / /

ProvinceOrState

California / /

Technology

semiconductor / radiation / tiny flip chip / polymerization / disk drive / heat transfer / Pentium chip / MEMS chips / one chip / laser / MEMS / Lasers / MEMS ink jet chip / dielectric / radio frequency / ink jet chip / flash / /

SocialTag