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![]() | Document Date: 2009-09-24 19:28:26Open Document File Size: 636,64 KBShare Result on FacebookCityFlex / San Diego / San Jose / /CompanyIBM / General Electric / Tessera / Sony / AMKOR / Dupont / Flex-Based Packaging Solutions / Texas Instruments / HP / Intel / / /IndustryTermbasic systems / metal posts / connection site / unusual processing / tiny flip chip / little metal / important technology / wafer-level systems / alternate method uses etching solution / metal heat spreader / heat management / ink jet chip / direct chip / energy / low cost processing / metal / removable carrier / fiberoptic Internet backbone / ultra-high density semi-additive processing / circuit solution / thin metal layer / chip carrier / carrier/foil2 / metal spheres / metal balls / metal plates / /MovieSoon / /OrganizationALIVH High-Density Printed Wiring Board / /PersonKen Gilleo / Francis Hugle / Van Nostrand Reinhold / /Positionconductor / /ProductDigital Micro DeviceTM / /ProgrammingLanguageDC / /ProvinceOrStateCalifornia / /Technologysemiconductor / radiation / tiny flip chip / polymerization / disk drive / heat transfer / Pentium chip / MEMS chips / one chip / laser / MEMS / Lasers / MEMS ink jet chip / dielectric / radio frequency / ink jet chip / flash / /SocialTag |