![Electromagnetism / Ball grid array / Printed circuit board / NSMD / Solder / Quad Flat Package / Flip chip / Through-hole technology / PCB / Electronics manufacturing / Electronic engineering / Electronics Electromagnetism / Ball grid array / Printed circuit board / NSMD / Solder / Quad Flat Package / Flip chip / Through-hole technology / PCB / Electronics manufacturing / Electronic engineering / Electronics](https://www.pdfsearch.io/img/a7df35de9974615f15f667fcb5391a38.jpg)
| Document Date: 2005-11-01 02:00:00 Open Document File Size: 155,70 KBShare Result on Facebook
Company Packages Lattice Semiconductor / BGA Packages Lattice Semiconductor / Lattice Semiconductor Corp. / / Continent North America / / / IndustryTerm higher resolution equipment / assembly equipment / imaging / / Organization Solder Mask Defined Pads / Non-Solder Mask Defined Pads / / / Technology Flip chip / X-ray / / URL www.latticesemi.com/legal / www.latticesemi.com / www.latticesemi.com/lit/docs/package/amkor_bga_appnote.pdf / www.amkor.com/Products/all_products / /
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