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Electromagnetism / Ball grid array / Printed circuit board / NSMD / Solder / Quad Flat Package / Flip chip / Through-hole technology / PCB / Electronics manufacturing / Electronic engineering / Electronics


PCB Layout Recommendations for BGA Packages October 2005
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Document Date: 2005-11-01 02:00:00

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File Size: 155,70 KB

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Company

Packages Lattice Semiconductor / BGA Packages Lattice Semiconductor / Lattice Semiconductor Corp. / /

Continent

North America / /

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IndustryTerm

higher resolution equipment / assembly equipment / imaging / /

Organization

Solder Mask Defined Pads / Non-Solder Mask Defined Pads / /

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Technology

Flip chip / X-ray / /

URL

www.latticesemi.com/legal / www.latticesemi.com / www.latticesemi.com/lit/docs/package/amkor_bga_appnote.pdf / www.amkor.com/Products/all_products / /

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