Thermal Analysis for 3D Integration GSA OctGene Matter, VP Application Engineering, DOCEA POWER © DOCEA Power - Confidential - Flip chip - Document - PDFSEARCH.IO

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	Thermal Analysis for 3D Integration GSA OctGene Matter, VP Application Engineering, DOCEA POWER © DOCEA Power - Confidential Add to Reading List Document Date: 2014-01-22 10:42:09 Open Document File Size: 2,13 MB Share Result on Facebook Organization General Services Administration / / Person Gene Matter / Package Balls / / Position VP Application Engineering / / ProgrammingLanguage Python / / Technology Heat transfer / SDRAM / •0.4mm ball pitch Assembly technology / 1.2 mm Flip-chip / 5 Memory-on-Logic 3D stack Circuit Technology / / SocialTag Electromagnetism Semiconductor device fabrication Three-dimensional integrated circuit Ball grid array Flip chip Network On Chip Electronics manufacturing Electronic engineering Electronics Integrated circuits

Thermal Analysis for 3D Integration GSA OctGene Matter, VP Application Engineering, DOCEA POWER © DOCEA Power - ConfidentialAdd to Reading List