Disco Type / Fraunhofer Institute / Measurement Fraunhofer Institute / 1 / 24mm Fraunhofer Institute / /
IndustryTerm
transportation / customer-specific applications / fluid pump systems / mask design technologies / metal / metal layer / active and passive devices / plastic film frame carrier / backend processing / industry-compatible process equipment / industrial services / programmable gas flow / post-processing / metrology services / manufacturing / passive devices / active devices / µm metal thickness / /
NaturalFeature
Smart Stream / /
Organization
Microintegration IZM Center / Fraunhofer Institute for Reliability G2 Interposer / FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER THINNING Fraunhofer IZM-ASSID / FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM TEMPORARY WAFER BONDING / Cu Center / INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER BUMPING ELECTROCHEMICAL DEPOS ITION IZM / Fraunhofer Institute for Reliability / /
FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM 3D S YS TEM INTEGRATION TS V INTERPOS ER Silicon interposers with through silicon vias (TSVs) are an important element for the realization of 3D system-in-pa