Back to Results
First PageMeta Content
Integrated circuits / Electronics manufacturing / Electromagnetism / Through-silicon via / Flip chip / Via / Solder / Three-dimensional integrated circuit / Electronic engineering / Electronics / Semiconductor device fabrication


CMOSAIC RTD 2009 Intra chip stack fluidic cooling: the CMOSAIC demonstrator
Add to Reading List

Document Date: 2013-05-29 05:14:58

Open Document

File Size: 1,22 MB

Share Result on Facebook

City

Lausanne / Zurich / Rüschlikon / /

Company

IBM / Mass Transfer Laboratory / 2Microelectronic Systems Laboratory / /

Country

Switzerland / /

Currency

pence / /

Facility

PYRAMID STACK / PYRAMID STACK Experimental Heat Transfer / Swiss Institute of Technology / /

IndustryTerm

interposer chip / 10x10mm chips / /

Organization

Institute of Technology / /

Person

Walter Riess / Martin Witzig / Ralph Heller / John Richard / Richard Stutz / Ute Drechsler / Chris Sciacca / /

ProgrammingLanguage

RC / /

Technology

Heat Transfer / 10x10mm chips / Silicon interposer chip / /

SocialTag