![Integrated circuits / Electronics manufacturing / Electromagnetism / Through-silicon via / Flip chip / Via / Solder / Three-dimensional integrated circuit / Electronic engineering / Electronics / Semiconductor device fabrication Integrated circuits / Electronics manufacturing / Electromagnetism / Through-silicon via / Flip chip / Via / Solder / Three-dimensional integrated circuit / Electronic engineering / Electronics / Semiconductor device fabrication](https://www.pdfsearch.io/img/c13e62b41b39c3e8715402b333122206.jpg)
| Document Date: 2013-05-29 05:14:58 Open Document File Size: 1,22 MBShare Result on Facebook
City Lausanne / Zurich / Rüschlikon / / Company IBM / Mass Transfer Laboratory / 2Microelectronic Systems Laboratory / / Country Switzerland / / Currency pence / / Facility PYRAMID STACK / PYRAMID STACK Experimental Heat Transfer / Swiss Institute of Technology / / IndustryTerm interposer chip / 10x10mm chips / / Organization Institute of Technology / / Person Walter Riess / Martin Witzig / Ralph Heller / John Richard / Richard Stutz / Ute Drechsler / Chris Sciacca / / ProgrammingLanguage RC / / Technology Heat Transfer / 10x10mm chips / Silicon interposer chip / /
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