![Heat transfer / Passive fire protection / Heat conduction / Water pollution / Heat sink / Thermal management of electronic devices and systems / Nusselt number / Microfluidics / Water cooling / Mechanical engineering / Thermodynamics / Chemical engineering Heat transfer / Passive fire protection / Heat conduction / Water pollution / Heat sink / Thermal management of electronic devices and systems / Nusselt number / Microfluidics / Water cooling / Mechanical engineering / Thermodynamics / Chemical engineering](https://www.pdfsearch.io/img/22c63f332ba9cb95c7b1b0a9fe7ccd6c.jpg)
| Document Date: 2013-05-28 16:20:41 Open Document File Size: 2,67 MBShare Result on Facebook
City Zurich / / Company 3D / IBM / B. Michel 1 Laboratory / Fluid Flow (submitted for publication 2013) Laboratory / / Country Switzerland / / Facility Laboratory of Thermodynamics / / IndustryTerm electronics / electronic chips / / Organization Department of Mechanical and Process Engineering / / Person Steady b / / Position representative / / Technology thermal performances Chip / laser / Heat transfer / Thermodynamics / 3D chip / Microfluidics / temperature visualization Chip / / URL www.ltnt.ethz.ch / /
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