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Semiconductor device fabrication / Materials science / Chemistry / Flip chip / Solder / IDMS


Investor Presentation Q4-2014
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Document Date: 2015-03-02 04:24:17

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File Size: 987,94 KB

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City

Shanghai / /

Company

Broadcom / Qualcomm / Financial Review / MediaTek / Standard packaging / /

Continent

Asia / Europe / /

Country

Switzerland / Singapore / Malaysia / Austria / United States / Netherlands / /

Currency

EUR / /

Event

Reorganization / Dividend Issuance / /

IndustryTerm

software engineering / foreign manufacturing operations / assembly equipment supplier / wearable devices / certain die bonding systems / assembly equipment / auto electronics / /

Person

Chandler Leshan / /

Product

FML / /

Technology

semiconductors / smart phones / /

SocialTag