Call For Papers The International Workshop on Advances in Sensors and Interfaces is a premier Sensor and Interface design workshop aimed at bridging the gap between electronic design and integrated circuit technologies,

Source URL: iwasi2017.poliba.it

• Wireless networking
• Wireless sensor network
• Sensor
• cole Polytechnique Fdrale de Lausanne
• Technology
• Education in Switzerland
• Higher education

Call for Contributions Special Issue on “Emerging Challenges and Solutions in SoC Verification” Verification has been one of the major bottlenecks in integrated circuit design process, which is exacerbated by the sh

Source URL: ieee-ceda.org

NRL BAA Announcement #ANALOG AND MIXED SIGNAL INTEGRATED CIRCUIT DESIGN AND CHARACTERIZATION The Electromagnetics Technology Branch of the Naval Research Laboratory (NRL) is

Source URL: heron.nrl.navy.mil

Programming for Future 3D Architectures with Manycore Introduction The shift from Systems-on-Chip (SoC) to manycore architectures brings new hardware and software challenges ranging from seamless integration of processo

Source URL: www.pro3d.eu

• Computing
• Engineering
• Parallel computing
• Computer engineering
• Computer architecture
• Manycore processors
• Microprocessors
• Emerging technologies
• Multi-core processor
• Computer-aided design
• Three-dimensional integrated circuit
• 3D modeling

1 Underdesigned and Opportunistic Computing in Presence of Hardware Variability Puneet Gupta1 , Member, IEEE, Yuvraj Agarwal2 , Member, IEEE, Lara Dolecek1 , Member, IEEE, Nikil Dutt6 , Fellow, IEEE, Rajesh K. Gupta2 ,

Source URL: mesl.ucsd.edu

• Engineering
• Computing
• Technology
• Parallel computing
• Computer memory
• Electronic design
• Electronic engineering
• Integrated circuit design
• Embedded system
• Multi-core processor
• Error detection and correction
• Software

Company Summary September, 2008 Telesensors, IncSolway School Road – Suite 111 Knoxville, TN4911

Source URL: sss-mag.com

• Electronic engineering
• Electronics
• Fabless semiconductor companies
• Engineering
• Integrated circuits
• Application-specific integrated circuit
• Field-programmable gate array
• Xilinx
• Mentor Graphics
• VHDL
• Ams AG
• Integrated circuit design

TRTA3 – IC Design INDUSTRY Roadmapping Pascal Viaud – STE Presented by Dr. Richard Hizon September 8, 2015

Source URL: industry.gov.ph

• Technology
• Semiconductor device fabrication
• Electronics
• Geography of Asia
• Fabless manufacturing
• Integrated circuit design
• Semiconductor industry
• Short Message Service
• Mentor Graphics
• Philippines
• Internet of things

Reusing VC Blocks Reuse of Virtual Components (VC), also known as hardware or silicon Intellectual Property (IP), has become a crucial strategy for design teams. Designers now face design cycle times as short as 3 months

Source URL: www.steinwrites.com

• Electronic engineering
• Electronics
• Engineering
• Integrated circuits
• Virtual Socket Interface Alliance
• Application-specific integrated circuit
• Reuse
• Verilog
• ARC
• Quality intellectual property metric

Design Choice: Hard or Soft Virtual Components? by Thomas Harms Marketing & Applications Manager, Europe System-on-a-Chip Design Technology (SoCDT) Organization Motorola Semiconductor Product Sector

Source URL: www.steinwrites.com

• Electronic engineering
• Electronics
• System on a chip
• Electronic design
• Electromagnetism
• Integrated circuits
• Embedded microprocessors
• Application-specific integrated circuit
• Virtual Socket Interface Alliance
• ARC
• E

Mixed-Signal Design Engineer Ridgetop Group seeks experienced Mixed Signal Design Engineers to contribute to the research and development of innovative integrated circuit solutions at its headquarters in Tucson, Arizona.

Source URL: www.ridgetopgroup.com

• Electronic engineering
• Engineering
• Electronic design
• Electrical engineering
• Semiconductor devices
• Integrated circuit
• Mixed-signal integrated circuit
• Post-silicon validation
• Analog-to-digital converter
• Transistor
• Circuit design
• Analog verification