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Metrology / Low-k dielectric / Materials science / International Technology Roadmap for Semiconductors


1 Table INTC1 2013 Interconnect Difficult Challenges
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Document Date: 2014-03-27 14:19:04


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File Size: 110,79 KB

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metal structures / manufacturable solutions / interconnect/packaging architecture design optimization tool / meet manufacturing targets / /

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Three-dimensional chip / dielectric / CMP / /

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