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Electronics / Electronic engineering / Interposer / Three-dimensional integrated circuit / JEDEC / Wire bonding / Semiconductor device fabrication / Integrated circuits / Microtechnology


3D IC Readiness GSA 3D IC Workshop October 22, 2014 Charles Woychik
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Document Date: 2014-10-23 00:17:41

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File Size: 1,87 MB

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City

San Jose / /

Company

Tessera Technologies Inc. / Charles Woychik Invensas Corporation / /

IndustryTerm

wearable devices / semiconductor interconnect solutions / owned subsidiary / imaging / level printing / resolution imaging / /

Organization

General Services Administration / Chip Assembly / /

Person

Min Micro-bump / /

Technology

semiconductor / direct bond Chip / X-ray System / Cu pillar Chip / 5 5 Invensas Technology / x-ray / /

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