Three-Dimensional Circuits LPKF LDS: Laser Direct Structuring for 3D Molded Interconnect Devices Innovative Product Design with MID Technology State-of-the-art technology: a circuit carrier was designed according to

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Date: 2014-08-08 06:12:03 Engineering Electromagnetism Electronic engineering Molded interconnect device Electronics manufacturing LPKF Laser & Electronics Photonics		Three-Dimensional Circuits LPKF LDS: Laser Direct Structuring for 3D Molded Interconnect Devices Innovative Product Design with MID Technology State-of-the-art technology: a circuit carrier was designed according to Add to Reading List Source URL: www.lpkf.com Download Document from Source Website File Size: 1,54 MB Share Document on Facebook

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