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Molded interconnect device
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1	Three-Dimensional Circuits LPKF LDS: Laser Direct Structuring for 3D Molded Interconnect Devices Innovative Product Design with MID Technology State-of-the-art technology: a circuit carrier was designed according to Add to Reading List Source URL: www.lpkf.com Language: English - Date: 2014-08-08 06:12:03 Engineering Electromagnetism Electronic engineering Molded interconnect device Electronics manufacturing LPKF Laser & Electronics Photonics
2	Get PCB Prototypes Sooner with In-House Rapid PCB Prototyping Save Time with In-House Prototyping In-house circuit board prototyping eliminates waiting for external suppliers. With LPKF systems and solutions, even compl Add to Reading List Source URL: www.lpkf.com Language: English - Date: 2016-02-16 05:18:44 Electronic engineering Engineering Electromagnetism Electronics manufacturing LPKF Laser & Electronics Printed circuit board Soldering Solder Reflow soldering Via ColorCAM Molded interconnect device
3	LPKF LDS Prototyping 3D MID Manufacturing Made Easy The Market for 3D Parts is Growing … Molded interconnect devices (MIDs) create new possibilities in product characteristics and production methods. The LDS method an Add to Reading List Source URL: www.lpkf.com Language: English Molded interconnect device Emerging technologies Metallizing Printed circuit board 3D printing Laser Software prototyping LPKF Laser & Electronics
4	Microsoft Word - Hagberg_empc2007.doc Add to Reading List Source URL: www.aspact.fi Language: English - Date: 2014-03-25 03:41:00 Packaging materials Thermoplastics Manufacturing Dielectrics Molded interconnect device Printed circuit board Injection molding Acrylonitrile butadiene styrene Polypropylene Technology Electromagnetism Plastics
5	ASPACT®, a Novel Circuiting Method for Molded Interconnect Devices (MID) Applications T. Kekonen, J. Hagberg, T. Kutilainen Aspocomp Oy Tutkijantie 13, 90570 Oulu, Finnland Zusammenfassung Add to Reading List Source URL: www.aspact.fi Language: English - Date: 2014-03-25 03:41:00 Manufacturing Plastics industry Molded interconnect device Plastics Injection molding Printed circuit board Materials science Acrylonitrile butadiene styrene Label Electromagnetism Technology Electronics manufacturing
6	3-Dimensional Circuitry Laser Direct Structuring Technology (LPKF-LDS) for Moulded Interconnect Devices Innovative product design through MID technology For a state-of-the-art dental hand-piece the basic attachment boar Add to Reading List Source URL: www.lpkf.com Language: English - Date: 2012-09-11 04:55:56 Integrated circuits Acronyms Laser Photonics Printed circuit board Application-specific integrated circuit Molded interconnect device LPKF Laser & Electronics Electromagnetism Electronics Electronic engineering
7	3-Dimensional Circuitry Laser Direct Structuring Technology (LPKF-LDSTM) for Moulded Interconnect Devices Innovative product design through MID technology For a state-of-the-art dental hand-piece the basic attachment bo Add to Reading List Source URL: www.lasermicronics.com Language: English - Date: 2012-11-22 07:25:50 Electronics manufacturing Solid freeform fabrication Electrical engineering Electronic engineering Printed circuit board Laser Plating Molded interconnect device Rapid prototyping Technology Physics Electromagnetism
8	DeuZert_Logo_4c mit DIN EN ISO[removed]eps Add to Reading List Source URL: www.lasermicronics.com Language: English - Date: 2012-11-22 07:22:11 Optics LPKF Laser & Electronics Laser beam welding Molded interconnect device Laser cutting Depanel Plastic welding Laser Ultrasonic welding Technology Mechanical engineering Welding