| Document Date: 2014-03-25 03:41:00
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City Oulu / University / / Company Mosen Co. Ltd. / Production Processes / Perlos Oyj / Service Requirements / Material Characteristics of Molded Interconnect Devices 3-D MID / EMPART / Selmic Oy / Microelectronics Laboratory / / / Facility University of Oulu Email / / IndustryTerm hot press tool / circuit board manufacturing / chemical bonding characteristics / plastics / video equipment / plastics materials / printing / hot pressing tool / electronics applications / large products / carrier foil / research / temporary carrier substrate / steel tool / transfer technology / photo imaging / electronics / molded interconnection devices / carrier substrate / rigid temporary carrier substrate / interconnection devices / control technology / metal layers / carrier foil strip / / Organization IMD / FI-90014 University of Oulu Email / / Position conductor / / Technology 3-D / Additive Circuit Transfer Technology / IML / IML technologies / photo imaging / control technology / IML technology / /
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