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Manufacturing / Plastics industry / Molded interconnect device / Plastics / Injection molding / Printed circuit board / Materials science / Acrylonitrile butadiene styrene / Label / Electromagnetism / Technology / Electronics manufacturing


ASPACT®, a Novel Circuiting Method for Molded Interconnect Devices (MID) Applications T. Kekonen, J. Hagberg, T. Kutilainen Aspocomp Oy Tutkijantie 13, 90570 Oulu, Finnland Zusammenfassung
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Document Date: 2014-03-25 03:41:00

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File Size: 606,10 KB

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City

Krautheim / /

Company

Service Requirements / Material Characteristics of Molded Interconnect Devices 3-D MID / Production Processes / Perlos Oyj / T. Kutilainen Aspocomp Oy / /

IndustryTerm

photo imaging / hot press tool / chemical bonding characteristic / plastics / electronics / video equipment / plastics materials / rigid temporary carrier substrate / carrier substrate / printing / hot pressing tool / control technology / electronics applications / large products / carrier foil / metal layers / printed circuit board manufacturing peel strength / temporary carrier substrate / chemicals / steel tool / /

Organization

IMD / /

Person

Minna Arra / /

Position

conductor / /

ProvinceOrState

Prince Edward Island / /

Technology

MID technologies / photo imaging / control technology / 3-D / IML technology / IML / /

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