| Document Date: 2012-11-22 07:25:50
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Company FPCB / Siemens Audiologische Technik GmbH / TRW Automotive / PET / Sn Ag / KaVo Dental GmbH. / / Event M&A / / Facility Institute of Micro Component / Institute of Micro Assembly Technik GmbH / / IndustryTerm carrier structures / car steering wheels / chip technology / plastics / car steering / laser-activatable plastics / bluetooth-technology / connection technologies / high processing speeds / physical-chemical reaction / introduced paint / circuit carrier / medical devices / healthcare devices / defined energy / healthcare solutions / metal surfaces / diagnostic applications / flip chip technology / portable electronics / manufacturing / technology meets / manufacturing processes / / Organization Institute of Micro Component / ASIC / Institute of Micro Assembly Technik GmbH / PC PPA / / Position designer / series Conductor / engineer / / Technology laser / ASIC / 8 Through-hole capability The LPKF-LDS technology / 3-Dimensional Circuitry Laser Direct Structuring Technology / LPKFLDSTM technology / mobile phones / LPKF-LDSTM technology / chip technology / MID technology / flip chip technology / using LPKF-LDSTM technology / bluetooth / connection technologies / flash / /
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3-Dimensional Circuitry Laser Direct Structuring Technology (LPKF-LDSTM) for Moulded Interconnect Devices Innovative product design through MID technology For a state-of-the-art dental hand-piece the basic attachment bo