| Document Date: 2012-09-11 04:55:56
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Company FPCB / Siemens Audiologische Technik GmbH / TRW Automotive / Sn Ag / KaVo Dental GmbH. / / Event M&A / / Facility Institute of Micro Component / Institute of Micro Assembly Technik GmbH / / IndustryTerm carrier structures / car steering wheels / field-proven systems / chip technology / car steering / laser-activatable plastics / bluetooth-technology / connection technologies / high processing speeds / software combines / physical-chemical reaction / circuit carrier / medical devices / 3D technology / healthcare devices / defined energy / healthcare solutions / metal surfaces / diagnostic applications / flip chip technology / portable electronics / manufacturing / intuitive software / technology meets / manufacturing processes / / Organization Institute of Micro Component / ASIC / Institute of Micro Assembly Technik GmbH / / Position designer / engineer / / ProgrammingLanguage HPGL / / Technology laser / LPKFLDS technology / ASIC / 8 Through-hole capability The LPKF-LDS technology / 3-Dimensional Circuitry Laser Direct Structuring Technology / Benchmark 3D technology / mobile phones / chip technology / MID technology / flip chip technology / bluetooth / using LPKF-LDS technology / connection technologies / flash / LPKF-LDS technology / laser system / /
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3-Dimensional Circuitry Laser Direct Structuring Technology (LPKF-LDS) for Moulded Interconnect Devices Innovative product design through MID technology For a state-of-the-art dental hand-piece the basic attachment boar