Nondestructive Method of TIM Bondline Measurement in Flip Chips Package H.c. Heng, V.S. Ben and K.H.Keok Advanced Micro Devices Export Sdn. Bhd. Phase III, Free Industrial Zone, Bayan Lepas, 11900 Penang, Malaysia Tel: (

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Date: 2016-07-20 11:09:32 Ultrasound Spectroscopy Microscopy		Nondestructive Method of TIM Bondline Measurement in Flip Chips Package H.c. Heng, V.S. Ben and K.H.Keok Advanced Micro Devices Export Sdn. Bhd. Phase III, Free Industrial Zone, Bayan Lepas, 11900 Penang, Malaysia Tel: ( Add to Reading List Source URL: www.sonoscan.com Download Document from Source Website File Size: 2,31 MB Share Document on Facebook