Nondestructive Method of TIM Bondline Measurement in Flip Chips Package H.c. Heng, V.S. Ben and K.H.Keok Advanced Micro Devices Export Sdn. Bhd. Phase III, Free Industrial Zone, Bayan Lepas, 11900 Penang, Malaysia Tel: ( - Mahas - Document - PDFSEARCH.IO

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	Nondestructive Method of TIM Bondline Measurement in Flip Chips Package H.c. Heng, V.S. Ben and K.H.Keok Advanced Micro Devices Export Sdn. Bhd. Phase III, Free Industrial Zone, Bayan Lepas, 11900 Penang, Malaysia Tel: ( Add to Reading List Document Date: 2016-07-20 11:09:32 Open Document File Size: 2,31 MB Share Result on Facebook

Nondestructive Method of TIM Bondline Measurement in Flip Chips Package H.c. Heng, V.S. Ben and K.H.Keok Advanced Micro Devices Export Sdn. Bhd. Phase III, Free Industrial Zone, Bayan Lepas, 11900 Penang, Malaysia Tel: (Add to Reading List