| Document Date: 2011-11-02 05:29:30
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City New York / / Company HIGHTEC MC AG / / Country United States / / Facility Karlsruhe Institute of Technology / / IndustryTerm possible interconnect solutions / coplanar flip chip / millimeterwave applications / chip technology / Wireless Communications / flip chip technology / carrier frequencies / flip chip / semiconductor technologies / attractive solution / metal layers / wave devices / flip-chip / / MusicGroup ISM / Radar / Data / System / / Organization European Union / T. Zwick Institut / Institute of Technology / / ProvinceOrState New York / / Technology mmw Radar technology / Microwave / Broadband / interconnect Flip chip technology / semiconductor technologies / flip chip / Simulation / coplanar flip chip / Silicon Germanium technology / flip chip technology / integrated circuits / dielectric / / URL http /
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Design and Measurement of Matched Wire Bond and Flip Chip Interconnects for D-Band System-in-Package Applications S. Beer, B. Ripka, S. Diebold, H. Gulan, C. Rusch, P. Pahl, T. Zwick Institut fuer Hochfrequenztechnik und