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Microtechnology / Flip chip / Micro-Opto-Electro-Mechanical Systems / Integrated circuit packaging / Microelectromechanical systems / Solder / Wire bonding / Integrated circuit / Nanophotonics / Semiconductor device fabrication / Materials science / Technology
Date: 2013-11-13 07:51:42
Microtechnology
Flip chip
Micro-Opto-Electro-Mechanical Systems
Integrated circuit packaging
Microelectromechanical systems
Solder
Wire bonding
Integrated circuit
Nanophotonics
Semiconductor device fabrication
Materials science
Technology

micronanofabricacion_centro_tecnologia_nanofotonica

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