Reliable testing of Cu pillar technology for smart devices By Amer Cassier, Lily Zhao, Ahmer Syed, Steve Bezuk, William Miller [Qualcomm] and Amy Leong, Mike Slessor [FormFactor Inc.] T

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Date: 2014-09-30 21:12:39 Electronic engineering Probe card Flip chip Microelectromechanical systems Reliability Solder Wafer testing Bead probe technology Millipede memory Semiconductor device fabrication Technology Materials science		Reliable testing of Cu pillar technology for smart devices By Amer Cassier, Lily Zhao, Ahmer Syed, Steve Bezuk, William Miller [Qualcomm] and Amy Leong, Mike Slessor [FormFactor Inc.] T Add to Reading List Source URL: www.formfactor.com Download Document from Source Website File Size: 1,29 MB Share Document on Facebook

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