Back to Results
First PageMeta Content
Electronic engineering / Moisture Sensitivity Level / Surface-mount technology / Reflow soldering / Rework / Printed circuit board / Solder / Chip carrier / JEDEC / Electronics manufacturing / Electromagnetism / Electronics


IPC/JEDEC J-STD-020D.1 March 2008 Supersedes IPC/JEDEC J-STD-020D August[removed]JOINT
Add to Reading List

Document Date: 2010-10-13 19:21:40

Open Document

File Size: 175,75 KB

Share Result on Facebook

City

Wilson Boulevard Arlington / Bannockburn / Arlington / /

Company

IPC Plastic Chip Carrier Cracking Task Group / ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES / JEDEC JC / /

Country

United States / /

/

IndustryTerm

component manufacturer / peripheral leaded metal lead frame packages / nonhermetic solid state surface mount devices / test equipment / proper product / guideline applications / device supplier / wave-soldered through-hole devices / heated gas / manufacturing / classified device / device manufacturer / /

MarketIndex

IPC 3000 / /

Organization

Committee on Reliability Test Methods / JEDEC Solid State Technology Association / Committee on Reliability Test Methods for Packaged Devices For Technical Information Contact / /

/

ProvinceOrState

Virginia / Illinois / /

Technology

bar code / Semiconductor Devices / ultrasound / Integrated Circuits / /

URL

www.ipc.org / www.jedec.org / www.ipc.org/html/testmethods.htm / /

SocialTag