Service Requirements / Material Characteristics of Molded Interconnect Devices 3-D MID / Production Processes / Perlos Oyj / T. Kutilainen Aspocomp Oy / /
IndustryTerm
photo imaging / hot press tool / chemical bonding characteristic / plastics / electronics / video equipment / plastics materials / rigid temporary carrier substrate / carrier substrate / printing / hot pressing tool / control technology / electronics applications / large products / carrier foil / metal layers / printed circuit board manufacturing peel strength / temporary carrier substrate / chemicals / steel tool / /