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Physical design / Multiple patterning / Design closure / Cadence Design Systems / Design flow / Placement / Standard cell / Routing / Nanoroute / Electronic engineering / Electronic design automation / Signoff


Increased demand for faster, smaller, low-power chips continues to drive the geometry shrink as one of the ways to manage the low-power, higher performance goals in smaller form factor. 40nm chips are state-of-the-art, 3
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Document Date: 2012-07-23 18:26:39


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Company

LiPo Li2 Poly Li1 Active (+) Metal / V0 Li2 Li1 Active (+) Metal / Lg / Active Metal 1 V0 Li2 Li1 Metal / V0 Li2 Li1 Metal 1 V0 Metal / Cadence Design Systems Inc. / /

Facility

Encounter Power System / /

IndustryTerm

Internet access / double-patterning technology / metal / high-k metal gate / wireless space / clock network / technology helps / graphics processors / electronics industry / metal shapes / Metal pitches / consumer devices / cell metal shapes / manufacturing flow / manufacturing / computing / 20nm process technology / clock networks / metal layers / low-power chips / 40nm chips / 20nm manufacturing requirements / signoff solution / /

Position

intent forward / rule-driven layout editor / /

Product

Encounter / 20nm / /

ProgrammingLanguage

DC / /

Technology

semiconductor / 20nm process technology / graphics processors / double-patterning technology / smartphones / design verification system / lithography / simulation / low-power chips / PDF / /

URL

www.cadence.com / /

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