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9![Improving the quality of barrier/seed interface by optimizing physical vapor deposition of Cu Film in hollow cathode magnetron A. Dulkin, E. Ko, L. Wu, I. Karim, K. Leeser et al. Citation: J. Vac. Sci. Technol. A 29, 041 Improving the quality of barrier/seed interface by optimizing physical vapor deposition of Cu Film in hollow cathode magnetron A. Dulkin, E. Ko, L. Wu, I. Karim, K. Leeser et al. Citation: J. Vac. Sci. Technol. A 29, 041](https://www.pdfsearch.io/img/86b2e82838382c4f8c204c6cca126f37.jpg) | Add to Reading ListSource URL: cpmi.illinois.eduLanguage: English - Date: 2015-04-22 08:46:32
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