Marvell NanoLab Member login Lab Manual Contents

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Date: 2012-11-20 13:15:45 Microtechnology Microelectromechanical systems Wafer Chemical vapor deposition Deep reactive-ion etching Stepper Reactive-ion etching Plasma etcher Sputtering Semiconductor device fabrication Materials science Technology		Marvell NanoLab Member login Lab Manual Contents Add to Reading List Source URL: nanolab.berkeley.edu Download Document from Source Website File Size: 44,40 KB Share Document on Facebook

	Control of Ion Energy in a Capacitively Coupled Reactive Ion Etcher H. M. Park , C. Garvin, D. S. Grimard and J. W. Grizzle Electronics Manufacturing and Control Systems Laboratory, Dept. of Electrical Engineering and C DocID: 1q0n7 - View Document
	Compensation for transient chamber wall condition using realtime plasma density feedback control in an inductively coupled plasma etcher Pete I. Klimecky, J. W. Grizzle, and Fred L. Terry, Jr. Department of Electrical En DocID: 1p5ql - View Document
	Plasma Prep III™ Solid State Low Temperature Asher/Etcher Operation Manual DocID: 14Q97 - View Document
	NANOELECTRONICS FABRICATION FACILITY (NFF), HKUST Standard Operating Manual ___________________________________________________________ Oxford Plasmalab 80 Plus Plasma Etcher DocID: ZcO9 - View Document
	Marvell NanoLab Member login Lab Manual Contents DocID: FUjH - View Document