Design Dependent Process Monitoring for Back-end Manufacturing Cost Reduction Tuck-Boon Chan∗ , Aashish Pant∗ , Lerong Cheng† , Puneet Gupta∗ {tuckie,apant,puneet}@ee.ucla.edu, [removed], ∗ Depa

Source URL: nanocad.ee.ucla.edu

• Semiconductor device fabrication
• Electromagnetism
• Wafer testing
• MOSFET
• Ring oscillator
• Very-large-scale integration
• Wafer
• Process corners
• Application-specific integrated circuit
• Electronic engineering
• Integrated circuits
• Electronics