<--- Back to Details
First PageDocument Content
Professional associations / Standards organizations / IEEE Electron Devices Society / Semiconductors / Technology / Institute of Electrical and Electronics Engineers / Siegfried Selberherr / ISPSD / International Electron Devices Meeting / Electronic engineering / Engineering / International nongovernmental organizations
Date: 2012-02-07 15:25:26
Professional associations
Standards organizations
IEEE Electron Devices Society
Semiconductors
Technology
Institute of Electrical and Electronics Engineers
Siegfried Selberherr
ISPSD
International Electron Devices Meeting
Electronic engineering
Engineering
International nongovernmental organizations

E LECTRON DEVICES S OCIETY IEEE ELECTRON DEVICES SOCIETY ISSN:

Add to Reading List

Source URL: eds.ieee.org

Download Document from Source Website

File Size: 377,41 KB

Share Document on Facebook

Similar Documents

PDF Document

DocID: 1vwMm - View Document

Simulation Tool for IGBT modules R. Schnell ABB Switzerland Ltd, Semiconductors, Fabrikstrasse 3, CH – 5600 Lenzburg, Switzerland e-mail: Abstract: ABB has recently released a new simulation

DocID: 1vk86 - View Document

Reducing Gate-Driven Leakage in 2D Semiconductors: Two-dimensional materials such as graphene and MoS2 have a wide range of bandgaps and effective masses, making them suitable for many different applications including m

DocID: 1vg3M - View Document

The Toyota Riken International Workshop Organic Semiconductors, Conductors, and Electronics  October 24, Wednesday Octeber 25, Thursday 9:00 Hisao Ishii

DocID: 1vehL - View Document

ABB Semiconductors AG Soft Punch Through (SPT) Soft Punch Through (SPT) – Setting new Standards in 1200V IGBT S. Dewar, S. Linder, C. von Arx, A. Mukhitinov, G. Debled

DocID: 1vaF8 - View Document