Fico AMS-W The Art of Substrate Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic.

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Date: 2014-12-11 08:37:54 Quad-flat no-leads package Pellet		Fico AMS-W The Art of Substrate Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. Add to Reading List Source URL: www.besi.com Download Document from Source Website File Size: 3,09 MB Share Document on Facebook