Fico AMS-W The Art of Substrate Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. - Quad Flat No-leads package - Document - PDFSEARCH.IO

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	Fico AMS-W The Art of Substrate Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. Add to Reading List Document Date: 2014-12-11 08:37:54 Open Document File Size: 3,09 MB Share Result on Facebook Company HANDLER VISION LEADFRAME HANDLER PELLET SUPPLY MOLDING PRESS / Molding Press / BOC / / / Facility bar Press / bar ÷÷ Max. / / IndustryTerm micro chips / end applications / / Organization ÷÷ Board Board / / Person Mark Mark / / Technology Bar code / / URL www.besi.com / / SocialTag Quad-flat no-leads package Pellet

Fico AMS-W The Art of Substrate Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic.Add to Reading List