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City Brugge / Berlin / San Diego / / Company Reno NV / Package INTRODUCTION Technologies / / Country Belgium / United States / / / Facility Technical University of Berlin Gustav-Meyer-Allee / Fraunhofer Institute / / IndustryTerm main process technology steps / technology results / embedded dies technologies / active chips / µm thin chips / manufacturing level / generic technology / large-area processing / technology demonstrator / laser drilling equipment / respective machinery / chip embedding technology / embedded flip chip / silicon chip / lower manufacturing cost / costly manufacturing / technology borders / power transistor chip / low cost solutions / interconnection technologies / miniaturized electronic systems / versatile solutions / chip embedding technologies / Screen printing / realized applications / technology focuses / package manufacturing / real manufacturing / integrated manufacturing concept / embedded die technology / integrated manufacturing line / process chain / thick chips / manufacturing / component embedding technologies / laser direct imaging / semiconductor chips / density electronic systems / / MusicGroup High Power / Ph.D. / / Organization Module Board / Fraunhofer Institute for Reliability and Microintegration / African Union / European Commission / Printed Circuit Board / European Union / Technical University of Berlin Gustav-Meyer-Allee / / Person Andreas Ostmann / Lars Boettcher / E. Bauer / Herbert J. Neuhaus / Herbert Reichl / / Technology semiconductor / chip embedding technology / embedded flip chip / principle Technology / using chip embedding technology / chip embedding technologies / existing interconnection technologies / silicon chip / Polymer technologies / few chips / embedded die technology / Epoxy resin Si Chip / Polymer technology / embedded dies technologies / so-called Chip / laser / existing technology / 50 µm thin chips / power transistor chip / dielectric / semiconductor chips / Embedded dual chip package CONCLUSIONS The Chip / generic technology / embedding technology / component embedding technologies / / URL http / SocialTag 
Embedding of Chips for System in Package realization – Technology and Applications Lars Boettcher 1, Dionysios Manessis 2, Andreas Ostmann 1 Stefan Karaszkiewicz 2 and Herbert Reichl 2 1 Fraunhofer Institute for Relia