122 GHz Antenna-Integration in a Plastic Package based on a Flip Chip Interconnect Stefan Beer, Thomas Zwick Karlsruhe Institute of Technology, Institut fuer Hochfrequenztechnik und Elektronik Kaiserstr. 12, 76131 Karlsr

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Date: 2011-11-02 05:26:11 Radio technology Quad-flat no-leads package Integrated circuit Flip chip Antenna Dipole antenna Radiation pattern Microwave RF MEMS Electronic engineering Telecommunications engineering Technology		122 GHz Antenna-Integration in a Plastic Package based on a Flip Chip Interconnect Stefan Beer, Thomas Zwick Karlsruhe Institute of Technology, Institut fuer Hochfrequenztechnik und Elektronik Kaiserstr. 12, 76131 Karlsr Add to Reading List Source URL: www.success-project.eu Download Document from Source Website File Size: 4,00 MB Share Document on Facebook

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