| Document Date: 2013-02-06 07:16:32
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Company LSI / Fujitsu Semiconductor / Yoshiyuki Yoneda Fujitsu Semiconductor Ltd. / / IndustryTerm process technologies / semiconductor chip thinning technology / high video processing capability / chip technology / metal joint / fragile silicon chip / memory products / memory chip / logic devices / highperformance devices / density mounting technologies / 3D mounting technology / connection technologies / conventional technologies / bumps consumer devices / Flip chip technology / car navigation systems / semiconductor chip / elemental technologies / system-on-a-chip / higher video processing capability / Image-processing / metal bumps / stationary devices / signal transmission design technologies / assembly technologies / presented semiconductor packaging technologies / interconnect technology / consumer products / mobile and stationary device applications / amusement applications / semiconductor packaging technologies / data processing buffer / electronic devices / still and moving image processing engines / mobile electronic devices / packaging technologies / metal-tometal diffusion / video processing / manufacturing / logic device / consumer/high-end devices / optimum packaging technologies / stationary electronic devices / semiconductor chips / flip chip connection technologies / / Organization African Union / US Federal Reserve / / Person Yoshiyuki Yoneda / Kouichi Nakamura / / Position thermosonic and thermocompression bonding Application General / / Technology semiconductor / 6.3 Chip / signal transmission design technologies / 3D mounting technology / presented semiconductor packaging technologies / flip chip connection technologies / high-density mounting technologies / semiconductor chip / semiconductor packaging technologies / changing process technologies / system-on-a-chip / CoC technologies / mobile phones / CoC technology / Flip chip technology / Mounting technology / image processing / mobile devices / One technology / fragile silicon chip / Packaging Technology / selected Semiconductor chip / memory chip / flash memory / optimum packaging technologies / semiconductor chip thinning technology / Chip on chip / smartphones / semiconductor chips / Cu pillar Cu pillar Semiconductor chip / conventional technologies / digital cameras / Stamped side Epoxy resin Semiconductor chip / chip technology / Mounting technologies / 6 6 connection technologies / packaging technologies / assembly technologies / / URL http /
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Packaging Technology for Image-Processing LSI Yoshiyuki Yoneda Kouichi Nakamura