![Radio technology / Quad-flat no-leads package / Integrated circuit / Flip chip / Antenna / Dipole antenna / Radiation pattern / Microwave / RF MEMS / Electronic engineering / Telecommunications engineering / Technology Radio technology / Quad-flat no-leads package / Integrated circuit / Flip chip / Antenna / Dipole antenna / Radiation pattern / Microwave / RF MEMS / Electronic engineering / Telecommunications engineering / Technology](https://www.pdfsearch.io/img/7dcde095708324f18e22cb515942a20c.jpg) Date: 2011-11-02 05:26:11Radio technology Quad-flat no-leads package Integrated circuit Flip chip Antenna Dipole antenna Radiation pattern Microwave RF MEMS Electronic engineering Telecommunications engineering Technology | | 122 GHz Antenna-Integration in a Plastic Package based on a Flip Chip Interconnect Stefan Beer, Thomas Zwick Karlsruhe Institute of Technology, Institut fuer Hochfrequenztechnik und Elektronik Kaiserstr. 12, 76131 KarlsrAdd to Reading ListSource URL: www.success-project.euDownload Document from Source Website File Size: 4,00 MBShare Document on Facebook
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