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Semiconductor device fabrication / Microtechnology / Etching / Plasma processing / Chemical milling / Isotropic etching / Plasma etching / Microelectromechanical systems / Buffered oxide etch


High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS
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Document Date: 2016-04-25 13:15:12


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File Size: 260,37 KB

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