First Page | Document Content | |
---|---|---|
Date: 2016-04-25 13:15:12Semiconductor device fabrication Microtechnology Etching Plasma processing Chemical milling Isotropic etching Plasma etching Microelectromechanical systems Buffered oxide etch | High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECSAdd to Reading ListSource URL: web.eecs.umich.eduDownload Document from Source WebsiteFile Size: 260,37 KBShare Document on Facebook |
acs_NL_nl-2011-02708d 1..5DocID: 1qJbN - View Document | |
Microsoft Word - Know-how InfodocDocID: 1p48Q - View Document | |
High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECSDocID: 1p1ER - View Document | |
WALL STATE EFFECTS ON Cl2 POLY-SI RIE: REAL-TIME MEASUREMENTS, MECHANISMS, AND FEEDBACK CONTROL SOLUTIONS Pete I. Klimecky, Jessy W. Grizzle, and Fred L. Terry, Jr. University of Michigan/EECS Dept. , RmBeal ADocID: 1ouLZ - View Document | |
PDF DocumentDocID: 1otwq - View Document |