1![Application Note Xe plasma FIB (i-FIB) Delayering technology using water as Gas-Assisting Etching Application Note Xe plasma FIB (i-FIB) Delayering technology using water as Gas-Assisting Etching](https://www.pdfsearch.io/img/b6227c475cc44026fb08d129ab073932.jpg) | Add to Reading ListSource URL: www.orsayphysics.comLanguage: English - Date: 2016-06-28 10:32:08
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2![Control of Ion Energy in a Capacitively Coupled Reactive Ion Etcher H. M. Park , C. Garvin, D. S. Grimard and J. W. Grizzle Electronics Manufacturing and Control Systems Laboratory, Dept. of Electrical Engineering and C Control of Ion Energy in a Capacitively Coupled Reactive Ion Etcher H. M. Park , C. Garvin, D. S. Grimard and J. W. Grizzle Electronics Manufacturing and Control Systems Laboratory, Dept. of Electrical Engineering and C](https://www.pdfsearch.io/img/f856dd57594626c83ee17ab50dfe8677.jpg) | Add to Reading ListSource URL: web.eecs.umich.eduLanguage: English - Date: 2016-04-25 13:15:14
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3![A Demonstration of Broadband RF Sensing: Empirical Polysilicon Etch Rate Estimation in a Lam 9400 Etch Tool Craig Garvin and J. W. Grizzle Department of Electrical Engineering and Computer Science, University of Michigan A Demonstration of Broadband RF Sensing: Empirical Polysilicon Etch Rate Estimation in a Lam 9400 Etch Tool Craig Garvin and J. W. Grizzle Department of Electrical Engineering and Computer Science, University of Michigan](https://www.pdfsearch.io/img/4ffb2338f883bd2b69b4cef89e0a856d.jpg) | Add to Reading ListSource URL: web.eecs.umich.eduLanguage: English - Date: 2016-04-25 13:15:11
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4![Compensation for transient chamber wall condition using realtime plasma density feedback control in an inductively coupled plasma etcher Pete I. Klimecky, J. W. Grizzle, and Fred L. Terry, Jr. Department of Electrical En Compensation for transient chamber wall condition using realtime plasma density feedback control in an inductively coupled plasma etcher Pete I. Klimecky, J. W. Grizzle, and Fred L. Terry, Jr. Department of Electrical En](https://www.pdfsearch.io/img/a5915a3e8442e82c556d2acdb83345bc.jpg) | Add to Reading ListSource URL: web.eecs.umich.eduLanguage: English - Date: 2016-04-25 13:15:14
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5![High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS](https://www.pdfsearch.io/img/7bc7436d640a11aad966c4f2c4fe715d.jpg) | Add to Reading ListSource URL: web.eecs.umich.eduLanguage: English - Date: 2016-04-25 13:15:12
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6![WALL STATE EFFECTS ON Cl2 POLY-SI RIE: REAL-TIME MEASUREMENTS, MECHANISMS, AND FEEDBACK CONTROL SOLUTIONS Pete I. Klimecky, Jessy W. Grizzle, and Fred L. Terry, Jr. University of Michigan/EECS Dept. , RmBeal A WALL STATE EFFECTS ON Cl2 POLY-SI RIE: REAL-TIME MEASUREMENTS, MECHANISMS, AND FEEDBACK CONTROL SOLUTIONS Pete I. Klimecky, Jessy W. Grizzle, and Fred L. Terry, Jr. University of Michigan/EECS Dept. , RmBeal A](https://www.pdfsearch.io/img/d3fda9d01ab330d3e6ceb8e6cd50884f.jpg) | Add to Reading ListSource URL: web.eecs.umich.eduLanguage: English - Date: 2016-04-25 13:15:14
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7![FLARION Series Plasma Reactors The FLARION series plasma reactors are custom designed for plasma-enhanced chemical vapour deposition (PECVD), plasma etching (PE), reactive or deep reactive ion etching (RIE, DRIE), or su FLARION Series Plasma Reactors The FLARION series plasma reactors are custom designed for plasma-enhanced chemical vapour deposition (PECVD), plasma etching (PE), reactive or deep reactive ion etching (RIE, DRIE), or su](https://www.pdfsearch.io/img/e37134d854ce196bfe98436b3c744557.jpg) | Add to Reading ListSource URL: www.plasmionique.comLanguage: English - Date: 2016-05-17 17:54:17
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8![Tin removal from extreme ultraviolet collector optics by inductively coupled plasma reactive ion etching H. Shin,a兲 S. N. Srivastava, and D. N. Ruzicb兲 Center for Plasma Material Interactions, University of Illinois Tin removal from extreme ultraviolet collector optics by inductively coupled plasma reactive ion etching H. Shin,a兲 S. N. Srivastava, and D. N. Ruzicb兲 Center for Plasma Material Interactions, University of Illinois](https://www.pdfsearch.io/img/a743551bc1c9e839c7e66945f82120b0.jpg) | Add to Reading ListSource URL: cpmi.illinois.eduLanguage: English - Date: 2015-04-22 08:46:31
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9![Environmentally Friendly Low Pressure Plasma Nanocoatings for Headsets Eva Rogge, MSc Nano4SME workshop Environmentally Friendly Low Pressure Plasma Nanocoatings for Headsets Eva Rogge, MSc Nano4SME workshop](https://www.pdfsearch.io/img/f5110ce84f7e5243d8108ed26c0525a3.jpg) | Add to Reading ListSource URL: www.minacned.nlLanguage: English - Date: 2014-06-05 03:45:48
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10![Progress in NUCLEAR SCIENCE and TECHNOLOGY, Vol. 1, pImprovement of Crystal Quality of a Homoepitaxially Grown Diamond Layer Using Plasma Etching Treatment for a Diamond Substrate Yuta KONNO1*, Junichi H Progress in NUCLEAR SCIENCE and TECHNOLOGY, Vol. 1, pImprovement of Crystal Quality of a Homoepitaxially Grown Diamond Layer Using Plasma Etching Treatment for a Diamond Substrate Yuta KONNO1*, Junichi H](https://www.pdfsearch.io/img/b4a11fbc077fb772cb84a191f5f76557.jpg) | Add to Reading ListSource URL: www.aesj.or.jp- Date: 2011-03-15 04:26:49
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