<--- Back to Details
First PageDocument Content
Electromagnetism / Electrical engineering / Mechanical engineering / Microelectromechanical systems / Transducers / Microsystem Technologies / Wafer bonding / Shuvo Roy / RF MEMS / Materials science / Microtechnology / Technology
Date: 2014-05-19 10:55:49
Electromagnetism
Electrical engineering
Mechanical engineering
Microelectromechanical systems
Transducers
Microsystem Technologies
Wafer bonding
Shuvo Roy
RF MEMS
Materials science
Microtechnology
Technology

FRAUNHOFER CAM IS A COMPETENCE CENTER FOR MICROSTRUCTURE DIAGNOSTICS A N D M AT E R I A L C H A R A C T E R I Z AT I O N WITHIN FRAUNHOFER IWM IN HALLE FRAUNHOFER CENTER

Add to Reading List

Source URL: www.iwm.fraunhofer.de

Download Document from Source Website

File Size: 895,83 KB

Share Document on Facebook

Similar Documents

Wafer-level Processes INSPECTION Checking for waferto-wafer bonding integrity Detection of internal

Wafer-level Processes INSPECTION Checking for waferto-wafer bonding integrity Detection of internal

DocID: 1shtL - View Document

Wafer-level Processes INSPECTION Checking for waferto-wafer bonding integrity Detection of internal

Wafer-level Processes INSPECTION Checking for waferto-wafer bonding integrity Detection of internal

DocID: 1rNMV - View Document

1  銅錫晶圓接合 CU/SN WAFER BONDING 范承翰

1 銅錫晶圓接合 CU/SN WAFER BONDING 范承翰

DocID: 1pUao - View Document

Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication

Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication

DocID: 1oWR7 - View Document

EV Group Joins IRT Nanoelec 3D Integration Program ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresis

EV Group Joins IRT Nanoelec 3D Integration Program ST. FLORIAN, Austria – Feb. 5, 2016 – EV Group (EVG), an industry-leading supplier of wafer-bonding, lithography/nanoimprint lithography (NIL), metrology, photoresis

DocID: 1nVjd - View Document